Die_attach3

Die-attachment equipment Automatic FINEPLACER®-145 ”Pico”: this machine is used to solder chips/devices on substrates or substrates/subassemblies inside packages (or any combination) utilizing either solder preforms or epoxies.

It is intended for any application involving die-attachment and it is programmable to run automatically. Vision pattern recognition, advanced alignment features and controlled mechanical parts allow for very flexible packaging technologies developments.

KS_wirebonder1
Manual_wire-bonder2

Wire bonder equipment K&S 8098 Wire Bonder and TPT model HB16: these machines allows the electrical interconnection between the chip/device metal pads to the substrate metal pads, or between the substrates/subassemblies metal pads to the package outputs pads.

The interconnection is realized using gold wire bonding with ball or wedge technology. INPHOTEC owns both an automatic large area ball wire bonder as well as a manual ball and wedge wire bonder to cover any necessity from development to production. The typically used wire is gold with 20 to 25 microns diameter and the pads on the devices can be either gold or aluminium.

pigtailing_bench1

Automatic multipurpose alignment bench from PImicos: the alignment bench is used to align and then fix together optical elements with sub-micron level of accuracy. The bench was designed having in mind the industrial necessities for an automatic handling of parts and an automatic pigtailing of photonic (or photonic related) devices. The main characteristics are reported here:

  • Optoelectronic diodes (eg: laser) alignment and pigtailing – active (sub-micron)
  • Fiber Array Pigtailing – active (sub-micron)
  • Complete vision assisted automatic prealignment and processing
  • UV and thermal epoxy curing
  • Robot handling (load/unload, revolving, UV supply, epoxy application)
  • High speed completely integrated processes (example: 12 way fiber array on grating pigtailing up to 5 pieces/hour)

Flip chip at submicron level die-attachment: the flip chip submicron equipment allows INPHOTEC to develop advanced technologies related to the passive positioning and attachment at the micron/submicron scale of optical components at wafer level. The idea here is to offer industries the technology to avoid, wherever it is possible, active alignment and to study and develop the so-called pluggable solution (that could avoid the use of fiber arrays). In fact such kind of problems related to optical interfaces are nowadays a sort of bottleneck in the silicon photonics field and this research is of fundamental importance, for example, in the industrial exploitation of silicon photonics in the datacom business.

Shear_tester1

Multifunctional bonder tester CONDOR 100-3 XYZTECH: the pull&shear tester available at INPHOTEC allows the testing of bond and die attachment resistance. The pull and shear tester has a Revolving Measurement Unit (RMU) which enables continuous operation with 4 different test types on the one machine.