LIST of the ADMITTED CADIDATES for 2nd EDITION IS AVAILABLE HERE

 

Courses on

Photonic Integrated Circuits Design, Fabrication & Packaging

 

 

The Integrated Photonic Technologies Center INPHOTEC, part of the TeCIP Institute of the Scuola Superiore Sant’Anna, in collaboration with CNIT (National Inter-University Consortium for Telecommunications), announces a comprehensive training program on photonic integrated circuits design and fabrication, and on photonic/electronic packaging and characterization.

INPHOTEC makes available during the courses to the enrolled trainees its 700 sqm highly professional fabrication facility and technology platforms for clean room live sessions.

Target candidates are coming from the academia and the industry with a master of science in the area of Electronic or Telecommunication Engineering or Physics, or professionals with adequate background who want to pursue intensive specialization courses with practical sessions in the complete line of design, fabrication, packaging and characterization.

The number of admitted trainees is limited to 20 units. A certificate of attendance will be released to participants.

Courses

  • Photonic Integrated Circuit Design and Fabrication (PIC D&F) [1 week]
  • Photonic and Electronic Integrated Circuit Packaging (PEIC Pack) [3 days]

A Characterization and Testing (C&T) session [up to 1 week] is offered to trainees after realization of the chip by INPHOTEC.

 

 

 

May 2017 edition
Course A PIC D&F

 

PIC D&F Morning Afternoon
Mon 8/5 Introduction to PICs Passive devices
Tue 9/5 Active devices and overview of PDK PHOENIX (OptoDesigner)
Wed 10/5 PHOENIX
(OptoDesigner/Inphotec PDK)
PHOENIX
 (Inphotec PDK)
Thu 11/5 PHOENIX
(Inphotec PDK/User Mask Design)
Inphotec Front-end platforms
& characterization
Fri 12/5 Visit to CleanRoom & Design Visit to CleanRoom & Design

 

Course B PEIC Pack

 

Pack Morning Afternoon
Mon 15/5 Introduction to PIC Packaging /
Basic Packaging Technologies
Basic Packaging Technologies
Tue 16/5 Lab session Basic Packaging Technologies
Wed 17/5 Lab session Advanced Packaging Technologies
and Reliability

 

Immagine3

REGISTRATION IS CLOSED

Deadline expired

Official Call

CONTACTS: Annalisa Bigi  tecip.edu@sssup.it  Ph. +39 050 88 2191