Make it real!
Turn your research results into real devices
Packaging and assembly technologies are fundamental to make the results of advanced photonic research available and practically usable. At present advanced photonic packaging technologies are not easily available and a historically weak or not coherent effort in developing such technologies has created what is now a clear major bottleneck for the future commercial exploitation of photonic devices.
The advanced packaging platform aims to support and develop back end and packaging technologies, starting from package design, process development up to engineering and prototyping.
Objectives for the platform are briefly summarized here:
- give packaging support for the overall photonics community, including sensors and MEMS based solutions
- facilitate access to customers asking for packaging developments
- offer best packaging solution and designs based on consideration of the whole picture
- offer prototyping up to small volume productions to SME and big industries using an automation line
The line is currently operative inside a 70 square meters area, part in class 10.000 and part in class 1000.
The main equipment includes the following:
- Automatic die-attach FINETECH model PICO
- Automatic ball wire bonder K&S
- Manual wire bonder TPT model HB16
- Automatic multipurpose Alignment and Pigtailing Bench
- Vision microscopy
- Flip-Chip die-attach with submicron tolerances (available from January 2016)
- Reflow/Vacuum Chamber (available from January 2016)
The main technologies includes the following:
- Die bonding, Flip Chip Bonding
- Tacking, In situ reflow, Eutectic Bonding
In particular a unique and innovative automatic bench for silicon photonics applications, that includes the pigtailing of fiber arrays as well of active devices (laser pill/Laser micropackage) has been designed and realized.