INPHOTEC will participate from 16-19 September at EMPC2019 conference
EMPC-2019 in Pisa offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. The four days will comprise Tutorials/Short Courses and the Conference and Exhibition during 16th to 19th September at the Palazzo Dei Congressi,
INPHOTEC will be present with a booth at the R&D Village, introducing the packaging line and some recent technological results.